New York, Feb 27, 2026, 10:07 EST — Regular session
- Broadcom slipped roughly 1.4% in early trading, moving in line with a softer Nasdaq.
- The chipmaker is rolling out a first 2nm custom compute SoC built for Fujitsu, while also pushing fresh 3D-stacked packaging targets.
- Broadcom’s March 4 results are on investors’ radar, as they hunt for clues on AI demand and profit margins.
Broadcom Inc shares lost 1.4%, trading at $317.23 Friday morning after moving between $310 and $317.61. The previous close: $321.70.
Investors are still tapping the brakes on parts of the chip sector, with Nvidia’s recent results stirring up fresh doubts about the pace of returns from the AI boom. Hyperscalers have put bold 2026 spending plans on the table, but “questions around enterprise ROI intensify,” said Jacob Bourne, analyst at eMarketer. Reuters
Broadcom is pushing its AI hardware ambitions into the spotlight. The company told Reuters it’s on track to move at least 1 million chips featuring its 3D-stacked design by 2027. That tech lets Broadcom mix components built on different process nodes, tapping Taiwan Semiconductor Manufacturing Co’s 2-nanometer and 5-nanometer technologies. “Now, pretty much all of our customers are adopting this technology,” said Harish Bharadwaj, Broadcom’s vice president of product marketing. The company is forecasting its AI chip revenue will jump to $8.2 billion in its fiscal first quarter, doubling year-on-year. Reuters
Broadcom announced Thursday that it has started shipping what it claims is the first 2nm custom compute system-on-chip using its 3.5D packaging platform. Frank Ostojic, senior vice president and GM of Broadcom’s ASIC products, said in the statement, “We’re proud to deliver the first 3.5D custom compute SoC for Fujitsu.” Naoki Shinjo at Fujitsu called the technology a breakthrough for compute density and energy efficiency in AI and high-performance computing. Barchart
A system-on-chip, known as an SoC, crams several computing tasks into one device. “2nm” points to the most advanced manufacturing process currently available. As for 3D packaging, that’s about stacking or directly bonding chips to shorten data travel and potentially trim power consumption.
Broadcom lost roughly 3.2% last session, dragged down as tech stocks slipped and the S&P 500 closed in the red.
Still, there’s a timing hazard here. Should cloud clients pull back on data-center outlays—or shift workloads to their own hardware and tools—outside chip vendors could see demand swing sharply.
The next hurdle comes soon. Broadcom will deliver its first-quarter fiscal 2026 results and business outlook on March 4 after the bell. Management will hold a conference call at 5:00 p.m. ET.
Investors are casting the moment as a push-and-pull: AI enthusiasm on one side, near-term semiconductor jitters on the other. Now, all eyes turn to Broadcom’s next earnings report.
Broadcom shares are behaving much like their peers—reacting sharply to news, swinging fast, and jittery at any suggestion that AI demand could be cooling. Investors now look to March 4, when Broadcom will deliver fresh numbers on AI chip orders, networking appetite, and margins.
