New York, Feb 27, 2026, 4:46 PM EST — After-hours
- Broadcom shares ended lower and slipped again in after-hours trading.
- Investors weighed fresh AI chip-packaging updates against a risk-off tape in U.S. tech.
- Focus turns to next week’s earnings and key U.S. data.
Broadcom Inc. shares fell 0.7% to close at $319.55 on Friday and were down 0.3% at $318.50 in after-hours trade. The stock ranged from $310.00 to $320.00 during the session. 1
The timing matters. Broadcom sits in the middle of the hardware buildout behind artificial intelligence, and chip names have been lurching around on each new data point — from spending plans to packaging breakthroughs and power use.
That backdrop is colliding with a steady drumbeat of AI “winners and losers” talk. “There continues to be this… back and forth,” said Kristina Hooper, chief market strategist at Man Group, pointing to the lack of clarity on which businesses get helped and which get replaced. 2
On Friday, the broader market stayed defensive. The S&P 500 fell 0.44% and the Nasdaq dropped 0.92% as investors fretted over AI disruption, tariff uncertainty and geopolitical tensions, while a hotter-than-expected producer price report kept rate-cut hopes in check. “This is a classic risk-off environment,” said Ryan Detrick, chief market strategist at Carson Group. 3
Broadcom, meanwhile, pushed more of its packaging story into public view. It said it has begun shipping what it called the industry’s first 2-nanometer custom compute system-on-chip, or SoC, for Fujitsu, built on its 3.5D packaging platform that stacks and bonds dies “face-to-face” to pack more compute into less space. “We’re proud to deliver the first 3.5D custom compute SoC for Fujitsu,” said Frank Ostojic, a senior vice president at Broadcom, while Fujitsu’s Naoki Shinjo called the launch “a transformative milestone.” 4
A day earlier, a Broadcom executive laid out an even bigger target. The company expects to sell at least 1 million “3D stacked” chips by 2027, a design approach that puts chips on top of each other so data moves faster while using less power. “Now, pretty much all of our customers are adopting this technology,” Harish Bharadwaj, Broadcom’s vice president of product marketing, told Reuters. 5
Broadcom’s custom work ties it to some of the largest AI buyers, and it has positioned itself as an alternative route to specialized silicon as Big Tech looks beyond off-the-shelf accelerators. That puts it in the same conversation as Nvidia and AMD when investors talk about who captures the next leg of data-center spending.
But the near-term trading tape is not a clean read on the technology. Packaging gains can be real and still take time to show up in shipments, margins and guidance — and chip stocks have been quick to punish anything that smells like a pause in big-customer spending.
The next catalyst is closer than the packaging road map. Broadcom is scheduled to report fiscal first-quarter results on March 4, after the market close. 6
