New York, Feb 27, 2026, 10:07 EST — Regular session
- Broadcom shares fell about 1.4% in morning trade, tracking a weaker Nasdaq.
- The chipmaker is pitching new 3D-stacked packaging targets and shipping a first 2nm custom compute SoC for Fujitsu.
- Investors are looking to Broadcom’s March 4 results for an update on AI demand and margins.
Broadcom Inc shares slipped 1.4% to $317.23 in morning trading on Friday, after swinging between $310 and $317.61 earlier in the session. The stock closed at $321.70 on Thursday. 1
The move comes as investors keep pressing the brakes on parts of the chip sector after Nvidia’s latest results revived questions about how fast the industry’s AI buildout will pay off. Hyperscalers have mapped out aggressive 2026 spending plans, but “questions around enterprise ROI intensify,” Jacob Bourne, an analyst at eMarketer, said. 2
Broadcom is trying to keep attention on its own AI hardware runway. The company told Reuters it expects to sell at least 1 million chips based on its 3D-stacked design by 2027, and said the approach can combine chips made on different process nodes, including Taiwan Semiconductor Manufacturing Co’s 2-nanometer and 5-nanometer processes. “Now, pretty much all of our customers are adopting this technology,” said Harish Bharadwaj, Broadcom’s vice president of product marketing, as the company projected its AI chip revenue would double year-on-year to $8.2 billion in its fiscal first quarter. 3
In a separate press release on Thursday, Broadcom said it has begun shipping what it called the industry’s first 2nm custom compute system-on-chip built on its 3.5D packaging platform. “We’re proud to deliver the first 3.5D custom compute SoC for Fujitsu,” said Frank Ostojic, senior vice president and general manager of Broadcom’s ASIC products division, while Fujitsu executive Naoki Shinjo said the technology “unlocks unprecedented compute density and energy efficiency” for AI and high-performance computing. 4
A system-on-chip, or SoC, packs multiple compute functions into a single device. The “2nm” tag refers to a leading-edge manufacturing process, and 3D packaging is a way of stacking or bonding chips so data travels shorter distances, which can cut power use.
Broadcom fell about 3.2% in the previous session, as a broader risk-off tone hit tech and the S&P 500 ended lower. 5
But the story still carries timing risk. If cloud customers slow data-center spending, or push more work into their own designs and tooling, demand for outside chip suppliers can turn lumpy fast.
The next test is close. Broadcom is scheduled to report first-quarter fiscal 2026 results and business outlook on March 4 after the market close, and management plans a conference call at 5:00 p.m. ET. 6
Some investors are already framing the setup as a tug-of-war between AI optimism and short-term nerves in semiconductors, with attention shifting to Broadcom’s coming earnings update. 7
For now, Broadcom’s stock is trading like the rest of the group: headline-driven, quick to swing, and sensitive to any hint of slowing AI demand. The next catalyst is March 4, when Broadcom reports and gives its next read on AI chip orders, networking demand and margins.
